Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I Comparison of experimental and Numerical Results

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I Comparison of experimental and Numerical Results

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science, Assiut University, Egypt
Research Member
Nabil Yassin Abdahavy Mohammed
Research Rank
2
Research Vol
Vol. 30, No. 4
Research Year
2002