Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I Comparison of experimental and Numerical Results

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I Comparison of experimental and Numerical Results

مؤلف البحث
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
مجلة البحث
Journal of Engineering Science, Assiut University, Egypt
مؤلف البحث
Nabil Yassin Abdahavy Mohammed
تصنيف البحث
2
عدد البحث
Vol. 30, No. 4
سنة البحث
2002