THE EFFECT OF USING FALSE CEILING ON ROOF COOLING LOAD

Research Authors
ALI H. Abdel Razek

Ibrahim S. Taha

Mahmoud G. Morsy

and Ali K. Abdel-Rahman
Research Journal
Journal of Engineering Sciences
Research Member
Mahmoud Jaber Marce al-Husseini
Research Pages
666–682
Research Publisher
Assiut University
Research Rank
2
Research Vol
Vol. 42 No. 3
Research Year
2014

THE EFFECT OF USING FALSE CEILING ON ROOF COOLING LOAD

Research Authors
ALI H. Abdel Razek

Ibrahim S. Taha

Mahmoud G. Morsy

and Ali K. Abdel-Rahman
Research Journal
Journal of Engineering Sciences
Research Member
Ibrahim Mohammad Shafie Taha
Research Pages
666–682
Research Publisher
Assiut University
Research Rank
2
Research Vol
Vol. 42 No. 3
Research Year
2014

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science,Faculty of Engineering, Assiut University
Research Member
Ibrahim Mohammad Shafie Taha
Research Publisher
Faculty of Engineering, Assiut University, Egypt
Research Rank
2
Research Vol
Vol. 32, No. 2
Research Year
2004

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part II: Parametric Study

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science, Faculty of Engineering, Assiut University, Egyp
Research Member
Hamdy Abo Ali Hassan Ibrahim
Research Rank
2
Research Vol
32(2)
Research Year
2004

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part II: Parametric Study

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science, Faculty of Engineering, Assiut University, Egyp
Research Member
Ibrahim Mohammad Shafie Taha
Research Rank
2
Research Vol
32(2)
Research Year
2004

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results

Research Authors
1- H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science
Research Member
Ibrahim Mohammad Shafie Taha
Research Publisher
Faculty of Engineering, Assiut University, Egypt
Research Rank
2
Research Vol
Vol. 30, No. 4
Research Year
2002

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I Comparison of experimental and Numerical Results

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science, Assiut University, Egypt
Research Member
Nabil Yassin Abdahavy Mohammed
Research Rank
2
Research Vol
Vol. 30, No. 4
Research Year
2002

Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part I: Comparison of experimental and Numerical Results”

Research Authors
H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk
Research Journal
Journal of Engineering Science, Faculty of Engineering, Assiut University, Egypt
Research Member
Hamdy Abo Ali Hassan Ibrahim
Research Rank
2
Research Vol
30(4)
Research Year
2002
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