Three Dimensional Transient Cooling of electronic Component in an Enclosure Enhanced by Heat Sink: Part II: Parametric Study | Faculty of Engineering

Faculty of Engineering

Research Authors

H. Hassan, I.S. Taha, N.Y. Abdel Shafey, and A.Y. Turk

Research Journal

Journal of Engineering Science, Faculty of Engineering, Assiut University, Egyp

Research Member

Hamdy Abo Ali Hassan Ibrahim

Research Rank

2

Research Vol

32(2)

Research Year

2004